Multichip Modules with Integrated Sensors Daniel W October 17-18

October 17-18

Wie schon im

Die Neuerungen des in der vorliegenden Diplomarbeit beschriebenen Systems beziehen sich auf den zugrunde liegenden objektorientierten Systementwurf

sollen zwei Fragestellungen den Verlauf der Arbeit bestimmen:

die alte Assoziationsmühle

Multichip Modules with Integrated Sensors Daniel W October 17-18Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by